Manju Mohan, RM. Kuppan Chetty, Vijayram Sriram, Mohd. Azeem, P. Vishal, G. Pranav, Vol. 1, No. 3, pp. 13-19, Sep. 2019
10.22662/IJASC.2019.1.3.013, Full Text:
Keywords: Node Mcu, Internet of Things (IoT), Node Mcu, Smart Waste Bin, Solid waste management, Ultrasonic Sensor

Abstract

Background/Objectives: Waste bins are part of our lives for decades and mostly its condition are overflowing due to improper waste dumping, collection and management, which leads in foul smell and unhygienic condition, thus inherently results in environment pollution. Methods/Statistical analysis: Therefore, in this paper, design of a Waste Bin with real time monitoring is presented and a smart waste management system is proposed using the recent technical advancements of automation and Internet of Things (IoT). Findings: The capacitance sensor in the bin continuously monitors the level of the bin in real time and communicates to the central cloud where the bins are connected. Ultrasonic sensor is used to open and close the lid of the bin whenever the persons are nearby the bin. Such smart bins are connected to the cloud, where the bin status are communicated, recorded and monitored by the local bodies through and android app or a centralized server. Improvements/Applications: Thus the designed smart bin and proposed waste management system have better level of smartness compared to existing ones in metropolitan cities in a centralized manner.

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